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    Technical Support
    FAQ
    What is different between Low Pressure Molding and Epoxy Potting?

    PA Hot melt LPM

    Epoxy molding

    Case

    Need

    Meed case

    Working temperature

    -70~150℃

    180℃

    Housing

    No need housing

    Need housing

    Cycle time

    2-60 seconds

    Chemical reaction needs 24 hours

    density

    0.98

    Above 1.2

    Curing

    Much less curing time

    Need curing

    Working space

    Occupy less space

    Occupy large space

    Energy consumption

    Low

    High

    Resin consumption

    Less

    Much more

    Process

    Simple

    Complex

    Vacuum pumping

    No need

    Need 

    Hits:  UpdateTime:2018-09-14 15:08:00  【Printing】  【Close
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